New Application Note – Berkeley Nucleonics Corporation / Arbitrary…

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The Model 675 High Performance AWG Series represents a key component for designing, testing, and characterizing next-generation Ultrasonic MEMS and components.

MEMS (Micro-Electro-Mechanical Systems) sensors leverage silicon’s unique mechanical properties to integrate mechanical structures able to sense acceleration, rotation, angular rate, vibration, displacement, heading, and other physical and environmental properties. Those considerations, united to an analog front end with an excellent harmonic distortion, produce a circuit that combines electrical circuits and 3-dimensional mechanical structures.

Nowadays, MEMS sensors and microphones are widely used in many applications starting from distance and motion detection, mobiles, IoT, drones, automotive, pressure measurements, and humidity and temperature sensing, to name a few.

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